Informationen über QFP Testsockel
QFP Testsockel
uwe electronic GmbH
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Peripheral leaded devices such as SOPs and QFPs introduce their own set of unique challenges into the testing environment. Because of these challenges, a common thought in the industry is that one could not use spring probe technology in leaded device test sockets. In the past we would have admitted that guaranteeing contact with QFPs was much more difficult than with QFNs or BGAs, but that has all changed with recent innovations at Synergetix. The primary challenge of leaded device testing is guaranteeing contact to the leads considering the large tolerance bands associated with these devices. In conventional alignment methodologies there are three ideas on how to align the device: Corner-Body Alignment on leaded devices typically uses the corners of the package, where no leads extend, to guide the device into the socket pocket. Unfortunately these corners are often obscured with varying degrees of mold flash, making consistent alignment virtually impossible. Under-Body Alignment utilizes the angled bottom of the package to guide the device into contact with the spring probes. While this may seem to be a feasible solution, it is usually quickly eliminated by a standard, but alarming angle tolerance of 0° to 12° on the bottom of the package body. |
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